ECM

Denglin (登临科技) Pre-IPO: First Look

29 Oct 2026 By Ke Yan, CFA, FRM
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Abstract: Denglin, a general-purpose graphics processing unit (GPGPU) chip provider for AI computing, has passed the HKEX listing hearing and is seeking a Main Board listing. CITIC, CSC and BOCI are the joint sponsors. We look at the company's core segments: GPGPU products and technical services. We then look at the company's financial profile, path to profitability, pre-IPO valuation and investor backing.

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About ECM & IPO Research

Research on Hong Kong and A+H equity offerings, from the first filing to the aftermarket. Coverage includes pre-IPO early thoughts on the business and valuation, analysis of the final deal terms and cornerstone investors, and updates as new prospectus versions are filed.

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