ECM

Nexchip (晶合集成) A+H IPO: Analysis of Deal Terms

30 Jun 2026 By Ke Yan, CFA
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Abstract: Nexchip, an IC foundry focused on display driver ICs and image sensors, launched its IPO to raise USD 897m through an A+H listing. CICC is the sole sponsor. In this note, we look at the deal terms and provide our thoughts on valuation for the company. We analyze reference A+H transactions, cornerstone and sponsor performance and assess the risk-reward of the deal.

GOERTEK (002241 CH) DAJIN (1081 HK) HUA HONG SEMI (1347 HK) Zijin Gold Intl (2259 HK) HANS CNC (3200 HK) GPIXEL (3277 HK) SG MICRO (3661 HK) CATL (3750 HK) GIGADEVICE (3986 HK) MONTAGE TECH (6809 HK) SMARTSENS (688213 CH) HUA HONG SEMICONDUCTOR (688347 CH) SMIC (688981 CH) SMIC (981 HK) CHERY AUTOMOBILE (9973 HK)

Highlighted Stocks

GOERTEK, DAJIN, HUA HONG SEMI, Zijin Gold Intl, HANS CNC, GPIXEL, SG MICRO, CATL, GIGADEVICE, MONTAGE TECH, SMARTSENS, HUA HONG SEMICONDUCTOR, SMIC, SMIC, CHERY AUTOMOBILE

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