Abstract: Longsys, a branded memory-module maker, raised HKD 6,803.2m (USD 867.7m) in net proceeds from its Hong Kong IPO and will list on the Stock Exchange of Hong Kong on Tuesday, September 8, 2026. In our previous note, we looked at the company's deal terms, cornerstone and sponsor track records, and valuation. In this note, we provide an update for the IPO before its trading debut.
9976 HK, Samsung Electronics, CNGR, ANJOY FOOD, NOVOSENSE, ESTUN, SHENZHEN LONGSYS ELECTRONICS, GIGADEVICE, GIGADEVICE SEMICONDUCTOR, MONTAGE TECH, MONTAGE, DOSILICON, Biwin Storage, SMIC, SMIC, Micron Technology
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